JPS6234430U - - Google Patents
Info
- Publication number
- JPS6234430U JPS6234430U JP12549885U JP12549885U JPS6234430U JP S6234430 U JPS6234430 U JP S6234430U JP 12549885 U JP12549885 U JP 12549885U JP 12549885 U JP12549885 U JP 12549885U JP S6234430 U JPS6234430 U JP S6234430U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- heating device
- heater block
- bonding position
- bond position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985125498U JPH0510357Y2 (en]) | 1985-08-17 | 1985-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985125498U JPH0510357Y2 (en]) | 1985-08-17 | 1985-08-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6234430U true JPS6234430U (en]) | 1987-02-28 |
| JPH0510357Y2 JPH0510357Y2 (en]) | 1993-03-15 |
Family
ID=31018447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985125498U Expired - Lifetime JPH0510357Y2 (en]) | 1985-08-17 | 1985-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510357Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023530706A (ja) * | 2020-06-18 | 2023-07-19 | クリック アンド ソッファ インダストリーズ、インク． | ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS605125U (ja) * | 1983-05-31 | 1985-01-14 | ロ−ム株式会社 | 半導体装置組み立て用ヒ−タブロツク |
| JPS6016430A (ja) * | 1983-07-08 | 1985-01-28 | Toshiba Corp | 半導体装置の製造方法 |
| JPS60167336A (ja) * | 1984-02-10 | 1985-08-30 | Hitachi Ltd | 加熱装置 |
-
1985
- 1985-08-17 JP JP1985125498U patent/JPH0510357Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS605125U (ja) * | 1983-05-31 | 1985-01-14 | ロ−ム株式会社 | 半導体装置組み立て用ヒ−タブロツク |
| JPS6016430A (ja) * | 1983-07-08 | 1985-01-28 | Toshiba Corp | 半導体装置の製造方法 |
| JPS60167336A (ja) * | 1984-02-10 | 1985-08-30 | Hitachi Ltd | 加熱装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023530706A (ja) * | 2020-06-18 | 2023-07-19 | クリック アンド ソッファ インダストリーズ、インク． | ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510357Y2 (en]) | 1993-03-15 |